发明名称 |
IC pocket |
摘要 |
The present invention provides an IC socket formed by attaching a socket frame to a test board via a contact sheet, wherein the contact sheet has a plurality of cantilever spring type contacts arranged on an insulation film and a spacer member, to tightly attach the socket frame to the test board via the contact sheet without any inclination.
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申请公布号 |
US2003045136(A1) |
申请公布日期 |
2003.03.06 |
申请号 |
US20020233500 |
申请日期 |
2002.09.04 |
申请人 |
YAMAICHI ELECTRONICS CO., LTD. |
发明人 |
SUZUKI KATSUMI;ITO TAKEHIRO |
分类号 |
G01R31/26;G01R1/04;G01R1/073;G01R3/00;H01R33/76;(IPC1-7):H05K1/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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