SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which a photo detector on a semiconductor bare chip is not contaminated and which has high reliability. SOLUTION: In a printed circuit board 1 on which the semiconductor bare chip with the photo detector is mounted, a frame-shaped projecting section 1b is formed to the peripheral section of an opening section 1a. The opening section 1a is formed at a place corresponding to the photo detector. When the semiconductor bare chip is flip-chip mounted on the printed circuit board 1, the semiconductor bare chip abuts against the top section of the projecting section 1b.