| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having a low dielectric property, a low hygroscopic property and excellent thermosetting property and an electronic element including an electronic part such as a semiconductor device and a thin film multilayer wiring board which has a resin cured film such as a surface protective film, a passivation film, interlayer insulating film excellent in film characteristics such as a low dielectric property and low hygroscopic property. SOLUTION: The thermosetting resin composition containing a fluoric resin having a thermosetting group and a polymerization initiator, the resin cured film formed by heat-polymerizing the thermosetting resin and the electronic member having the film are provided. |
