| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating method which does not need roughening treatment by chemicals, when electroless-plating a resin substrate which incorporates a plating catalyst. SOLUTION: This method is characterized by forming mechanical recesses on the resin substrate which incorporates the plating catalyst, before electroless plating it, and making the recesses have a shape like a wedge or a hole, depths of about 10μm, and distances among the recesses of about 50μm.
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