发明名称 |
Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processes based on metrology |
摘要 |
An electrochemical processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. An electrochemical deposition unit provides a space to receive said microelectronic workpiece to deposit a subsequent film layer onto a prior layer, wherein a condition signal from the metrology unit influences the process control of the electrochemical deposition unit. The signal can also be used to transfer the microelectronic workpiece to a layer stripping unit, or a layer enhancement unit, or to a non-compliance station. The apparatus is particularly useful in measuring seed layer thickness and adjusting the operating control of a computational fluid dynamic reactor, which electroplates a process layer onto the seed layer.
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申请公布号 |
US2003066752(A1) |
申请公布日期 |
2003.04.10 |
申请号 |
US20020213399 |
申请日期 |
2002.08.06 |
申请人 |
RITZDORF THOMAS L.;EUDY STEVE L.;WILSON GREGORY J.;MCHUGH PAUL R. |
发明人 |
RITZDORF THOMAS L.;EUDY STEVE L.;WILSON GREGORY J.;MCHUGH PAUL R. |
分类号 |
C25D21/12;(IPC1-7):C25D21/12;C25B9/00;C25C7/00 |
主分类号 |
C25D21/12 |
代理机构 |
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代理人 |
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地址 |
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