发明名称 |
Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements |
摘要 |
Embodiments of the present invention provide methods for measuring a wafer surface. A portion of the wafer surface is measured using a particle counter to provide first measurements corresponding to a plurality of points on the wafer surface. A selected area of the wafer surface including one of the plurality of points is measured using an atomic force microscope (AFM) to provide a microroughness measurement of the selected area. The selected area is a localized area of the portion of the wafer surface measured using the particle counter. The first measurements and the microroughness measurement are provided as a measurement of the wafer surface. The portion measured using a particle counter may, for example, be substantially the entire wafer surface.
|
申请公布号 |
US6552337(B1) |
申请公布日期 |
2003.04.22 |
申请号 |
US20000688283 |
申请日期 |
2000.10.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO KYOO-CHUL;HEO TAE-YEOL;AN JEONG-HOON;KIM GI-JUNG |
分类号 |
G01B21/30;G01B7/34;G01B11/30;G01N15/08;G01N19/08;G01Q60/24;H01L21/66;(IPC1-7):H01J37/26 |
主分类号 |
G01B21/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|