发明名称 Isolation of alpha silicon diode sensors through ion implantation
摘要 An image sensor. The image sensor array includes a substrate. An interconnect structure is formed adjacent to the substrate. An amorphous silicon electrode layer is adjacent to the interconnect structure. The amorphous silicon electrode layer includes electrode ion implantation regions between pixel electrode regions. The pixel electrode regions define cathodes of an array of image sensors. The electrode ion implantation regions provide physical isolation between the pixel electrode regions. The cathodes are electrically connected to the interconnect structure. An amorphous silicon I-layer is adjacent to the amorphous silicon electrode layer. The amorphous silicon I-layer forms an inner layer of each of the image sensors. A transparent electrode layer is formed adjacent to the image sensors. An inner surface of the transparent electrode is electrically connected to anodes of the image sensors and the interconnect structure. The amorphous silicon I-layer region can further include I-layer ion implantation regions that provide physical isolation between the inner layers of the image sensors. The I-layer ion implantation regions align with the electrode ion implantation regions. An amorphous silicon P-layer can be formed adjacent to the amorphous silicon I-layer. The amorphous silicon P-layer forms an outer layer of each of the image sensors. The amorphous silicon P-layer region can include P-layer ion implantation regions that provide physical isolation between the outer layers of the image sensors.
申请公布号 US2003107100(A1) 申请公布日期 2003.06.12
申请号 US20030349447 申请日期 2003.01.22
申请人 CAO MIN;THEIL JEREMY A.;RAY GARY W.;VOOK DIETRICH W. 发明人 CAO MIN;THEIL JEREMY A.;RAY GARY W.;VOOK DIETRICH W.
分类号 H01L27/146;H01L31/10;(IPC1-7):H01L31/00 主分类号 H01L27/146
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