| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal foil with a resin which is superior in a dielectric characteristic and by which a fine via can be worked and to provide a multilayer printed-circuit board. SOLUTION: The metal foil with the resin has a resin layer which contains a benzocyclobutene resin and an ultraviolet absorber. Preferably, the metal foil has a resin layer which comprises a first layer containing the benzocyclobutene resin and a second layer containing the benozocyclobutene resin, and it has a resin layer containing the ultraviolet absorber in at least one layer from among the first layer and the second layer. The multilayer printed-circuit board is formed in such a way that the metal foil with the resin is overlapped with one face or both faces of an inner-layer circuit board so as to be heated and pressurized. COPYRIGHT: (C)2003,JPO |
