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发明名称
具有与支撑板相隔开之晶粒底部的表面安装封装体
摘要
一种依据本发明的半导体封装,其包含一在其之内部的空间收容了MOSFET的金属密封外壳。如此收容的MOSFET系被安置成使得其之汲极系面对密封外壳的底部,且其系藉由一层导电性的环氧基树脂或焊料或其之类似物而电气连接至密封外壳的底部。如此安置的MOSFET的边缘系与该密封外壳的壁隔离。该MOSFET的边缘和密封外壳壁之间的空间系充填绝缘层。该MOSFET的表面系齐平于该基材平面之下0.001-0.005寸的平面以减少温度周期变化失效。
申请公布号
TW200301553
申请公布日期
2003.07.01
申请号
TW091136907
申请日期
2002.12.20
申请人
国际整流器公司
发明人
马丁 史坦汀;安德鲁N 史威尔
分类号
H01L23/28
主分类号
H01L23/28
代理机构
代理人
恽轶群;陈文郎
主权项
地址
美国
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