| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspecting device possible to improve the throughput by prevent alignment errors. SOLUTION: An inspecting device is provided with an XY stage 10, on which a semiconductor wafer 5 is placed and a center-up mechanism 30 arranged on the XY stage 10, which rotates, while holding the semiconductor wafer 5. An autofocus mechanism 40 detects a edge of the semiconductor wafer 5, rotated at prescribed angle by the center-up mechanism 30 in the semiconductor wafer 5. An operation processing part 50 calculates the center coordinates or the direction of the semiconductor 5, based on a detected signal and coordinate information of the XY stage 10. COPYRIGHT: (C)2003,JPO |
