发明名称 STABLE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a stable organo polysilica composition containing a B-staged organo polysilica resin and to provide a method for stabilizing such a B-staged organo polysilica resin composition and a method for manufacturing an electronic device using such as a stable composition. SOLUTION: This method for manufacturing an electronic device including forming a porous organo polysilica dielectric material comprises the steps of depositing on an electronic device substrate a stable composition including a B-staged organo polysilica resin, a porogen (pore forming substance) and an organic acid having two carbons or more and having a pKa of about 1 to about 4, wherein the composition is substantially free of alcohol of reaction, curing the B-staged organo polysilica resin to form an organo polysilica dielectric material and removing the porogen to provide a porous organo polysilica dielectric material deposited on the substrate. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003206403(A) 申请公布日期 2003.07.22
申请号 JP20020333272 申请日期 2002.11.18
申请人 SHIPLEY CO LLC 发明人 YOU YUJIAN;GORE ROBERT H;GALLAGHER MICHAEL K
分类号 C08L83/04;C08J9/26;C08K5/09;(IPC1-7):C08L83/04 主分类号 C08L83/04
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