| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg excellent in dielectric characteristics, laser processability and flame retardancy, and a printed wiring board. SOLUTION: The prepreg is prepared by impregnating a nonwoven fabric composed of an organic fiber with a resin composition comprising a cyanate resin and/or a prepolymer thereof, a phenolic resin and an inorganic filler. The printed wiring board is prepared by laminating a metallic foil on the prepreg, followed by pressure-molding under heating. COPYRIGHT: (C)2003,JPO |
