发明名称 SUBSTRATE TRANSFER HANDLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate transfer handling device capable of controlling the remaining amount of solvent which affects line width fluctuation. SOLUTION: The evaporation speed of a remaining solvent is controlled by a solvent control means 200 which comprises an atmosphere keeping chamber 101 which holds a wafer W in which a resist film is formed and keeps the atmosphere over the wafer W by enclosing the wafer W held by a pair of tweezers 110 for transfer, a plurality of gas supply means 120A and 120B capable of supplying gas to different concentric circles on the surface of wafer W, exhausting means 130A and 130B which exhaust the gas supplied from the gas supply means 120A and 120B and form a stream of gas on the surface of wafer W, and mass flow controllers C1, C2, C3, and C4 capable of adjusting the amount of gas supplied by the gas supply means 120A and 120B and also the amount of gas exhausted by the exhaust means 130A and 130B. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003229355(A) 申请公布日期 2003.08.15
申请号 JP20020028575 申请日期 2002.02.05
申请人 TOKYO ELECTRON LTD 发明人 SHINYA HIROSHI;KITANO TAKAHIRO
分类号 B65G49/07;H01L21/027;H01L21/677;H01L21/68;(IPC1-7):H01L21/027 主分类号 B65G49/07
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