发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To suppress treatment liquid from bubbling at the lower part of a treatment tub of a substrate treatment device in which the treatment liquid is supplied from above the substrate in the treatment tub. SOLUTION: A development device 3 comprises a buffer plate 35 below a transfer line H. A part of development liquid, which is supplied from a development liquid supply pipe 33, that is supplied to a part where no substrate exists collides with the buffer plate 35 to reduce its speed, so that the speed with which hitting occurs against the development tub 31 or the development liquid held in the development tub 312 is reduced. Thus, bubbling of development liquid is suppressed. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003229356(A) 申请公布日期 2003.08.15
申请号 JP20020028856 申请日期 2002.02.06
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KIYONO KAZUAKI;WADA HIDEKAZU;TAKISHITA TAKAYOSHI
分类号 G03F7/30;B05C3/10;H01L21/027;H01L21/677;H01L21/68;(IPC1-7):H01L21/027 主分类号 G03F7/30
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