发明名称 |
APPARATUS AND METHOD FOR GAP FORMATION |
摘要 |
PROBLEM TO BE SOLVED: To perform accurate gap formation by a single substrate press device even for a two-layered substrate using a seal material differing in solvent mixing ratio, etc., without causing any seal pass, etc. SOLUTION: Upper and lower press units 10 and 11 of the substrate press device 8 have press plates 13 and 14 which are heated in a high-temperature state and substrate preheating members 15 and 16 which have metallic thin heat conduction plates 15a and 16a on which plate heaters 15b and 16b are stuck. The substrate preheating members 15 and 16 are attachable/detachable to/from the press plates 13 and 14; and the substrate preheating member 15 moves down from a standby position where both the substrate preheating members 15 and 16 are detached from the two-layered substrate 4 together with the press plate 13 and the members 15 and 16 clamp the two-layered substrate 4 to preheat and pressurize it and the press plate 13 is further moved down by a pressuring means 18 to press the two-layered substrate 4 by both the press plates 13 and 14 in a high-temperature state. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003228077(A) |
申请公布日期 |
2003.08.15 |
申请号 |
JP20020027546 |
申请日期 |
2002.02.05 |
申请人 |
HITACHI ELECTRONICS ENG CO LTD |
发明人 |
YUMIBA KENJI;ICHIKAWA HISAYOSHI;SUGIZAKI SHINJI;NAKAMURA SHIGERU |
分类号 |
G02F1/13;B30B15/02;B30B15/34;G02F1/1339;G09F9/00;(IPC1-7):G02F1/133 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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