发明名称 METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic circuit board at low cost by maintaining the quality of the ceramic circuit board, while raisin a burning efficiency. SOLUTION: In a method for manufacturing a ceramic circuit board 10, a pattern is formed in a baked ceramic substrate 11 by post-attach baking formation, in a belt-type continuous baking furnace 20 of which a belt 21 is rotated endlessly. The method comprises a first step of mounting baking jigs 22 on both end parts in the width direction of the belt 21, respectively; a second step of mounting a ceramic substrate 11 between the respective baking jigs 22 on the belt 21; a third step of mounting the ceramic substrates 11 on the respective baking jigs 22, so as to overlap partially the ceramic substrate 11 on the belt in planar view, without coming into contact with the ceramic substrate 11 on the belt viewed in a sectional view; and a fourth step of continuously baking a wiring pattern 12 for post-attachment to the ceramic substrate 11. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003234562(A) 申请公布日期 2003.08.22
申请号 JP20020032130 申请日期 2002.02.08
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 NAKAMURA FUMIYOSHI;OKUMURA KOSEI
分类号 H05K3/12;H05K3/46;(IPC1-7):H05K3/12 主分类号 H05K3/12
代理机构 代理人
主权项
地址