| 摘要 |
PROBLEM TO BE SOLVED: To provide an LD chip examining apparatus which shortens a handling time of the chip and can easily deal with an increase or a decrease in examining items. SOLUTION: The laser diode chip examining apparatus comprises a plurality of LD chips 1 arranged along an array state groove 41 on a surface placing part of a pallet 2 having the groove 41 formed in the array state, a detector 7 for detecting a laser beam 9 emitted by energizing the chips to examine the LD chip characteristics. The apparatus further comprises an X-Y stage 3 movable in a two-dimensional plane for placing the pallet 2, and a holder 6 for holding the mirror 8 vertically movable for reflecting the beam 9 to arrive at the detector 7 above the stage 3. Thus, the holder 6 is lowered to move the mirror 8 to the emitting position of the beam 9 of the chips 1, and when the chips 1 are emitted to examine the chip characteristics, a depth of the groove 41 is provided so that the mirror 8 may not be brought into contact with the bottom of the groove 41. COPYRIGHT: (C)2003,JPO
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