| 发明名称 |
Adhesive for bonding an optoelectronic device |
| 摘要 |
An adhesive for bonding an optoelectronic device within a hermetically sealable package comprising a low outgassing adhesive selected to limit the outgassing of organic molecules in a cured state.
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| 申请公布号 |
US2003165305(A1) |
申请公布日期 |
2003.09.04 |
| 申请号 |
US20020091055 |
申请日期 |
2002.03.04 |
| 申请人 |
DALLAS JOSEPH L.;IRVIN ANGELIQUE X.;IRVIN ROBERT W.;JAMESON RALPH S.;MAMAKOS WILLIAM A. |
发明人 |
DALLAS JOSEPH L.;IRVIN ANGELIQUE X.;IRVIN ROBERT W.;JAMESON RALPH S.;MAMAKOS WILLIAM A. |
| 分类号 |
G02B6/42;(IPC1-7):G02B6/42;C09J4/00 |
主分类号 |
G02B6/42 |
| 代理机构 |
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