| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the mechanical and thermal stresses, improve the efficiency of heat dissipation, reinforce the mechanical junction between a resin mold part and a heat sink, enhance the quality of adhesion, and improve the moisture resistant characteristic without providing a notch. <P>SOLUTION: A resin sealed-type semiconductor device in which a semiconductor element 4 is fastened onto a semiconductor element mounting part 3 on a heat sink 2, the semiconductor element 4 and an outer lead 6a are brought into electrical conduction via an inner lead 12, and the semiconductor element 4, part of the lead 6a and part of an outer lead 6b extended from the heat sink 2 are sealed with resin to form a resin mold part 7, wherein a first coining part 22 and a second coining part 23 the thicknesses of which are thinner than that of the heat sink 2 are provided on the outer circumferential part, opposed to the heat sink 2, on which the semiconductor element 4 is mounted, and at least one groove 24 is provided between the second coining parts 23. <P>COPYRIGHT: (C)2003,JPO</p> |
