| 摘要 |
PROBLEM TO BE SOLVED: To take out signal lines easily from the central part of the lower surface of an electronic component package at the time of mounting an electronic component on a printed wiring board, and in addition, to prevent the occurrence of radiation noise by preventing the malfunction of an electronic circuit mounted with the electronic component. SOLUTION: An auxiliary package 5 for wiring is provided with external terminals 7<SB>1</SB>and 7<SB>1</SB>formed correspondingly to external terminals formed at the central part of the lower surface of the electronic component package of a semiconductor integrated circuit, etc., and internal wiring circuits 6 and 6 which connect external terminals 7<SB>2</SB>and 7<SB>2</SB>formed correspondingly to external terminals formed in the outer peripheral section of the lower surface of the package and the external terminals 7<SB>1</SB>and 7<SB>1</SB>to each other. The external terminals provided at the central part of the lower surface of the package are connected to the external terminals 7 through through holes 4 formed in the printed wiring board 3, and the signal lines are led out through the internal wiring circuits 6 and external terminals 7<SB>2</SB>. In a spaces between adjacent internal wiring circuits 6 and 6, a solid pattern 9 composed of a conductive material is formed and connected to a power source or a grounding wire. COPYRIGHT: (C)2004,JPO |
