发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the generation of a dust from a suscepter rotating device or the failure of a rotational operation. SOLUTION: An RTP device 10 is equipped with a treatment chamber 11 for housing a wafer 1, a suscepter 35 set in the treatment chamber 11 for holding the wafer 1, a first heating lamp group 25 and a second heating lamp group 26 for heating the wafer 1 held by the suscepter 35, and a suscepter rotating device 40 for rotating the suscepter 35. A brushless DC motor is used for the suscepter rotating device 40, and a stator (fixer) 42 constituted of an electromagnet (coil) is fixed to the outer peripheral face of a yoke 41. A rotor 46 is disposed outside the stator 42 like a concentric circle with an air gap (clearance) set, and supported so as to be freely rotatable by a ball gearing 45. Therefore, it is possible to directly rotate the suscepter, and it is possible to omit a gear which generates dusts, vibration, and an abnormal sound and a bearing which causes a rotational failure depending on the level of fastening. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003289050(A) 申请公布日期 2003.10.10
申请号 JP20020091899 申请日期 2002.03.28
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ITO TAKESHI
分类号 C23C16/44;H01L21/205;H01L21/22;H01L21/26;(IPC1-7):H01L21/26 主分类号 C23C16/44
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