发明名称 |
HIGHER ORDER SILANE COMPOSITION AND PROCESS FOR FORMING SILICON FILM USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To obtain a higher order silane composition which contains a higher order silane compound having a larger molecular weight from the viewpoint of wettability, boiling point and safety upon its application onto a substrate, and especially can easily form a high-quality silicon film, and a process for forming the excellent silicon film using the composition. SOLUTION: The higher order silane composition contains the higher order silane compound obtained by photopolymerizing a solution of a photopolymerizable silane compound or a photopolymerizable silane compound in a liquid state by exposing it to ultraviolet irradiation. In the process for forming the silicon film, the higher order silane composition is applied onto a substrate. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003313299(A) |
申请公布日期 |
2003.11.06 |
申请号 |
JP20020119961 |
申请日期 |
2002.04.22 |
申请人 |
SEIKO EPSON CORP;JSR CORP |
发明人 |
AOKI TAKASHI;FURUSAWA MASAHIRO;MATSUKI YASUO;IWAZAWA HARUO;TAKEUCHI YASUMASA |
分类号 |
C01B33/029;C01B33/04;C08G77/60;C09D183/16;H01L21/208;H01L21/368;(IPC1-7):C08G77/60 |
主分类号 |
C01B33/029 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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