| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To contrive the miniaturization, the facilitation of assembling and the reduction of a manufacturing cost of a semiconductor device by simplifying the structure of a case. <P>SOLUTION: The semiconductor device is miniaturized as a whole by a method wherein a die-cast case 1 is employed as a case wherein a semiconductor module, a control unit, a smoothing capacitor, a current sensor and the like are constituted, while a terminal block 4 led outward through the die-cast case 1 is provided to provide the terminal block 4 with a connecting unit 4a for a semiconductor chip 3 and a connecting unit 4b for an external instrument. <P>COPYRIGHT: (C)2004,JPO</p> |
