| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem in a conventional technique that, since a trouble is apt to be generated by the reason of permeation of moisture in the case of current flowing, vibration from the outside and an unbalanced load due to a shock in a structure in which a thermoelectric semiconductor element and a metal electrode are retained on an electric insulating substrate in a thermoelectric module having a thermoelectric element like a Peltier element, shield by a sealing solvent and a jacket for fixing a thermoelectric module which is described by JP 3055679 are provided for countermeasures of the trouble, however, the prevention of permeation of moisture and an unbalanced-load withstanding force are not sufficient in both the means. SOLUTION: The periphery of a thermoelectric module is surrounded by a sealing member having elasticity. Thermally conductive members are arranged on the whole of the heat generating surface and the heat absorbing surface of the thermoelectric module, respectively. The sealing member is compressed and fixed by the thermally conductive members, and a trench is formed in the whole periphery or a part of at least one surface of the sealing member. As a result, the vibration resistance, shock resistance and hermetically sealing property of the thermoelectric module are increased. COPYRIGHT: (C)2004,JPO |
