| 摘要 |
PROBLEM TO BE SOLVED: To optimize a parameter value used in global alignment of an aligner during a mass production operation. SOLUTION: The aligner 1 performs AGA measurement by using a prescribed sample shot group formed on a wafer, and decides a correction parameter. Measured values of a plurality of sample shots on the wafer are obtained by reflecting the obtained correction parameter, and they are informed to a central processing unit 4 with the correction parameter (data transfer 18). The wafer exposed by using the correction parameter is inspected by an overlap inspection device 3, and inspection/measurement positions of a plurality of sample shots are informed to the central processing unit 4 (data transfer 19). The central processing unit 4 decides an offset used for an alignment processing based on the correction parameter, measurement positions and the inspection/ measurement positions, which are collected for a plurality of photosensitive substrates, and it is informed to the aligner 1 (data transfer 20). COPYRIGHT: (C)2004,JPO |
