| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a polyimide film suffering from small dimensional changes both at ordinary temperature and at a higher temperature and suitable for a substrate for a fine pitch circuit. SOLUTION: The method for manufacturing the polyimide film comprises obtaining a polyamic acid solution by employing p-phenylenediamine and 4,4'- diaminodiphenyl ether as the aromatic diamine components and pyromellitic dianhydride and biphenyltetracarboxylic acid dianhydride as the aromatic acid anhydride components with the amounts thereof adjusted so that the molecular weight per unit of the polyamic acid molecule is at most 420, subjecting the thus-obtained polyamic acid solution to solvent removal and drying off followed by imidization to give a polyimide film, and annealing the polyimide film at a temperature of 350-400°C. COPYRIGHT: (C)2004,JPO |
