| 摘要 |
PROBLEM TO BE SOLVED: To achieve high mechanical strength and reduce static electricity having influences on a board as much as possible by constituting a device by use of a material which can be easily controlled to a desired resistance value providing a uniform resistance value over the device. SOLUTION: Fullerene (C<SB>60</SB>) is incorporated into polyether etherketone to prepare a composite, and a wafer carrier is manufactured by injection-molding the composite as a material. Even in a region shown in the frame F2 where an increase in conductivity for the packing is the steepest, the rise in the conductivity is gentle. Therefore, it is possible to easily control to desired resistance values (surface resistance: 10<SP>4</SP>to 10<SP>11</SP>Ω/cm), in particular to a lower value (10<SP>4</SP>Ω/cm). COPYRIGHT: (C)2004,JPO |
