| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg which enhances adhesive strength to a copper foil in an insulation layer having a p-aramid nonwoven fabric as the base material, and can contribute to further improvement of part mounting reliability, and a laminated plate having an inner layer circuit obtained by using this prepreg. SOLUTION: In the prepreg obtained by impregnating the p-aramid nonwoven fabric having a porosity of 30-55% as the base material with an epoxy resin composition comprising an epoxy resin, a curing agent, and a curing accelerator and semi-curing the impregnated p-aramid nonwoven fabric, in the outer layer of a copper foil directly laminated on the prepreg of a laminated plate having an inner circuit obtained by using the prepreg, sufficient copper foil adhesive strength can be stably secured and as a result, the prepreg can also contribute to the improvement of part mounting reliability. COPYRIGHT: (C)2004,JPO |
