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发明名称
半导体装载站对准装置
摘要
本发明揭示一种具有配准面与对准测量面之外壳之半导体装载站对准装置。在外壳内靠近对准测量面之处设有复数个感应器。以一处理器连接该复数个感应器。
申请公布号
TW200308042
申请公布日期
2003.12.16
申请号
TW092108182
申请日期
2003.04.10
申请人
布鲁克斯自动机械公司
发明人
哥登贝克哈德;巴特利克可纳罗;卡宾哈雷;卡姆兰华利瓦沙利
分类号
H01L21/68
主分类号
H01L21/68
代理机构
代理人
杜汉淮
主权项
地址
德国
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