ELECTRONIC COMPONENT COMPRISING A MULTILAYER SUBSTRATE AND CORRESPONDING METHOD OF PRODUCTION

摘要

The invention relates to a highly integrated electronic component that comprises at least one chip component (CB), especially a surface acoustic wave filter, and a multilayer substrate (MS). Said multilayer substrate comprises integrated circuit elements for impedance transformation (IW) and additional integrated circuit elements and is used as a carrier substrate for chip components and discrete circuit elements (SE) disposed on the surface thereof. The inventive component allows integration of a plurality of signal processing functions in one compact component, whereby especially the impedance of a chip component disposed on the multilayer substrate can changed from a characteristic to a different predetermined value.