| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide manufacturing method of an IC card in which a recess for housing an IC chip is easily formed to desired shape and depth and productivity is improved. <P>SOLUTION: When forming the recess 49 for housing the IC chip on a surface of a card body 30, a film piece 21 peelable from an inner core sheet 26a in accordance with the form of the recess 49 is built in a portion where the recess 49 is formed. Then, the cutting blade 57 of a punch is moved to depth which passes through the film piece 21 but does not pass through the card body 30, and the portion where the recess 49 is formed is blanked. The film piece 21 is peeled from the inner core sheet 26a to form a smooth bottom face 49A of the recess, and the recess 49 of the desired shape and depth is easily formed by one time of working. <P>COPYRIGHT: (C)2004,JPO |
