METHOD FOR MEASURING BONDING STRENGTH OF MULTILAYERED FILMS

摘要

PURPOSE: A method for measuring bonding strength of Multilayered Films is provided to easily measure the bonding strength and preciseness of the Multilayered Films according to a heat-treatment temperature. CONSTITUTION: Two outer contacts(11) and two inner contacts are provided and a test sample(13) is precisely positioned in four contacts. A dead point bending test is carried out in such a manner that a pair of substrates are subject to uniform stress between two inner contacts. A notch(12) is positioned on a lower substrate. When the notch(12) is broken, destructive energy of a lower pair of substrates, destructive energy of each insulation layer, and destructive energy of an upper silicon substrate are measured. The distance between inner and outer contacts is about 5mm.