NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition having high sensitivity and high resolution and exhibiting less film loss in a developed exposure section.

SOLUTION: The negative photosensitive resin composition contains: (A) a polyamide resin containing a structure shown in general formula (1); (B) a compound generating an acid by light; and (C) a compound having at least two or more 3,4-dihydro-2H-pyran groups in a molecule.

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