| 摘要 |
PURPOSE: To increase the number of signal pins without changing the shape of a substrate or a device in the multilayer substrate and the semiconductor device which comprise a ground layer, a power supply layer, a signal layer, and vias for interlayer connection of these layers. CONSTITUTION: In the multilayer substrate wherein the ground layer 31, the signal layer 32, the power supply layer 33, ground vias 35, signal vias 36, power supply vias 37, etc. are formed in an insulation material 30, a lowest layer ground layer 41 is formed in the lowest layer of the insulation material 30 except the portions where a signal land 26S and a power supply land 26P are formed. The lowest layer ground layer 41 is connected to the ground layer 31 via the ground vias 35. The lowest layer ground layer 41 is used as a ground land in packaging. Consequently, some ground pins can be eliminated, and hence the number of the signal pins can be increased by the number of the ground pins which have been eliminated. |
