| 摘要 |
A microelectronic device (24) is formed by plating a layer of material (36) to fill a cavity (28) formed in a substrate (26). The layer of material has a plurality of regions (42, 44, 46) with respective chemical compositions formed by varying the chemical composition of the plating solution as the layer of material is being deposited. In this manner, expensive additives necessary to achieve desired properties within the cavity may be omitted from the region (46) of overfill that will be removed by a later planarization process.
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