| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive composition which is useful for producing electric/electronic materials, is excellent in elongation, heat resistance, chemical resistance, and water-resistant adhesiveness, gives a high-resolution polyimide pattern, and has a high storage stability. <P>SOLUTION: The photosensitive composition contains (A) a polyamic acid ester wherein, based on the total molar number of aromatic groups constituting tetracarboxylic acids, benzene groups account for 5-30%; diphenyl ether groups, 20-90%; and the sum of benzene groups and diphenyl ether groups, at least 50%, (B) an organotitanium compound in an amount of 0.3-10 wt.%, (C) a solvent, (D) a photoinitiator, and (E) an assistant adhesive. <P>COPYRIGHT: (C)2004,JPO |
