发明名称 Atomic layer deposition method using a group IV metal precursor
摘要 Disclosed herein is an atomic layer deposition method which comprises forming a metal oxide thin film by using, as a group IV metal precursor, a complex of a formula M(L)2 in which M is a group IV metal ion having a charge of +4 and L is a tridentate ligand having a charge of -2, the ligand being represented by the following formula (I): <CHEM> wherein each of R1 and R2, independently, is a linear or branched C1 SIMILAR 4 alkyl group; and R3 is a linear or branched C1 SIMILAR 5 alkylene group. The group IV metal precursor of the present invention exhibits excellent thermal and chemical stabilities under a carrier gas atmosphere, whereas it has high reactivity with a reaction gas.
申请公布号 EP1273683(A3) 申请公布日期 2004.04.14
申请号 EP20010307026 申请日期 2001.08.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 MIN, YO SEP;KIM, DAE SIG;CHO, YOUNG JIN;LEE, JUNG HYUN
分类号 C07C225/06;C07F7/28;C23C16/40;C30B25/02;H01L21/20;H01L21/316 主分类号 C07C225/06
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