TRANSPARENT POLYIMIDE SILICON RESIN HAVING THERMOSETTING GROUP FOR PRODUCING SOLIDIFIED FILM

摘要

PURPOSE: Provided is polyimide silicon resin soluble in solvent, having thermosetting group to produce solidified film exhibiting excellent adhesion ability to various substrates and transparency at visible ray area by heat treatment for short time at low temperature. CONSTITUTION: The polyimide silicon resin comprises structural units represented by formulas 1 and 4 (wherein X is quaternary organic group having 4 or more of carbon atoms and one of the carbon atoms is bonded to the plural number of -CO- group; Y is diamine residual group having phenyl group; and Z is diaminosiloxane group) and is soluble in organic solvent. The silicon resin has thickness of 10 micrometers and light transmission rate of 80% or more measured at wavelength ranged of 400 to 700nm. The polyimide silicon resin can be used in production of semiconductor device or display device.