MULTI CHIP PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A multi chip package is provided to reduce the fabricating cost and time by eliminating the necessity that an active surface of one semiconductor chip among stacked semiconductor chips should be a mirror image of an active surface of another semiconductor chip. CONSTITUTION: Plural bonding pads are formed on the active surface of the first semiconductor chip(21). Plural bonding pads are formed on the active surface of the second semiconductor chip(22). The first and second semiconductor chips are attached to a die pad(24). Inner leads(27) are separated from the die pad. Bonding wires(29) electrically connect the bonding pads(23) of the first and second semiconductor chips with the inner leads. A package body(201) encapsulates the die pad, the first and second semiconductor chips, the inner leads and the bonding wires. Outer leads(28) are built in the inner leads, protruding to the outside of the package body. The first and second semiconductor chips are the same. The bonding pads in the first and second semiconductor chips are of an edge pad structure. The active surface of the first semiconductor chip is attached to the lower portion of the die pad and the inactive surface of the semiconductor chip is attached to the upper portion of the die pad, so that the active surfaces face the same direction. When the active surface of the first semiconductor chip is attached to the lower portion of the die pad, the bonding pads on the active surface of the first semiconductor chip is formed near the die pad.