发明名称 Insulated door assembly with low thermal deflection
摘要 Compression molded pigmented door skins fabricated by compression molding a pigmented, curable, unsaturated polyester sheet molding compound containing a co-curable unsaturated monomer, a low profile additive, and a microvoid-reducing thermoplastic polymer, exhibit uniform stainability while maintaining a low linear thermal coefficient of expansion. Such door skins are suitable for preparing wood grain textured exterior insulated doors which exhibit minimal thermal deflection when exposed to interior/exterior temperature differentials, even at eight foot door heights. The doors may be stained without first applying a seal coat.
申请公布号 US6740279(B2) 申请公布日期 2004.05.25
申请号 US20010754513 申请日期 2001.01.04
申请人 TT TECHNOLOGIES, INC. 发明人 WEST KENNETH J.;SCHEFFEL GREG W.;TEMPLETON G. DANIEL;DAVIS, III EUGENE R.
分类号 C08J5/24;B29C43/00;B29C43/02;B29C70/46;B29K101/10;B29L31/00;B44C5/04;B44F9/02;C08L67/06;E06B3/70;E06B3/78;E06B3/86;(IPC1-7):B29D2/00;C08K5/14 主分类号 C08J5/24
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