发明名称 HEATING STRUCTURE AND THERMAL SENSOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heating structure and a thermal sensor having high-reliability output characteristics. <P>SOLUTION: A tabular substrate in which an aperture is bored is formed, and a supporting film 4 is formed on the whole of the surface of the substrate 1. A heating resistor 6 of a specified pattern made of a platinum film is formed on the supporting film 4, and a protective film 5 is formed on the whole surface of the supporting film 4 so as to cover the heating resistor 6. By removing a part of the substrate 1 in such a way as to reach the supporting film 4 from the rear face side of the substrate 1, a cavity 2 is formed below the formation region of the heating resistor 6, and a heating structure 8A of a diaphragm section is formed. Each of the supporting film 4 and the protective film 5 is made of a silicon nitride film having a < 2.25 refractive index. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004156988(A) 申请公布日期 2004.06.03
申请号 JP20020322230 申请日期 2002.11.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAGUCHI MOTOHISA;KAWAI MASAHIRO
分类号 G01F1/692;G01K1/16;(IPC1-7):G01F1/692 主分类号 G01F1/692
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