| 发明名称 |
Variable cross-section plated mushroom with stud for bumping |
| 摘要 |
An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.
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| 申请公布号 |
US6750134(B2) |
申请公布日期 |
2004.06.15 |
| 申请号 |
US20030339377 |
申请日期 |
2003.01.09 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
AMADOR GONZALO;ARBUTHNOT DIANE LOUISE |
| 分类号 |
H01L21/027;H01L21/60;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/027 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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