| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount on a board highly accurately and at a high speed such an electronic component as a bare IC chip which is fed so as to have its connection surface upside. <P>SOLUTION: In an electronic-component mounting apparatus 1 which has an upside-down-component carrying means 25 for feeding electronic components 2 from a component feeding portion 5 to a component feeding position B, a mounting head 15 moving between the component feeding position B and a component mounting position A in the X-direction, and a board positioning means 7 for positioning a board 3, the upside-down-component carrying means 25 comprises a transferring means 26 for so taking out the respective electronic components 2 from the component feeding portion 5 as to transfer them, a first shuttle 27 for so holding thereon the plurality of transferred electronic components 2 in a line in the X-direction as to be able to move to a delivery position in the X-direction, and a second shuttle 28 which so holds collectively the plurality of electronic components 2 delivered from the first shuttle 27 as to turn them collectively upside down and so moves in the X-direction as to allocate them to the component feeding position B. <P>COPYRIGHT: (C)2004,JPO |
