发明名称 |
Structure, system, and method for assessing electromigration permeability of layer material within interconnect |
摘要 |
For determining electromigration permeability of a layer material, a test line, a feeder line, and a cathode line of an interconnect test structure are formed with current flowing from the test line through the feeder line to the cathode line. A no-flux structure is disposed between the cathode line and the feeder line, and the layer material is disposed between the feeder line and the test line. A respective current density and length product of the feeder line and the test line is respectively less than and greater than a respective critical Blech length constant. An occurrence of a void within the feeder line or the test line indicates that the layer material is permeable or impermeable.
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申请公布号 |
US6762597(B1) |
申请公布日期 |
2004.07.13 |
申请号 |
US20020283625 |
申请日期 |
2002.10.30 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
HAU-RIEGE CHRISTINE;HAU-RIEGE STEFAN;MARATHE AMIT P. |
分类号 |
G01R31/28;H01L23/522;H01L23/532;H01L23/58;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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