发明名称 |
Overlay measuring method and system, and method of manufacturing semiconductor device using the same |
摘要 |
An overlay measuring method includes irradiating an electron beam onto a sample, including a multi-layered structure of overlapped upper and lower patterns formed thereon, to obtain an actual image of the upper and lower patterns. A first image representing the upper pattern and a second image representing the lower pattern are obtained from the actual image. A reference position for the upper and lower patterns is determined from a design image of the upper and lower patterns. A position deviation of the upper pattern with respect to the reference position in the first image and a position deviation of the lower pattern with respect to the reference position in the second image are calculated to determine an overlay between the upper pattern and the lower pattern. |
申请公布号 |
US9455206(B2) |
申请公布日期 |
2016.09.27 |
申请号 |
US201514796478 |
申请日期 |
2015.07.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Yun Seong-Jin;Ko Woo-Seok;Yang Yu-Sin;Lee Sang-Kil;Jun Chung-Sam |
分类号 |
H01L21/66;H01J37/22 |
主分类号 |
H01L21/66 |
代理机构 |
Lee & Morse, P.C. |
代理人 |
Lee & Morse, P.C. |
主权项 |
1. A method of manufacturing a semiconductor device, the method comprising:
preparing a multi-layered structure of an upper pattern and a lower pattern, the lower pattern being formed by a first semiconductor process, the upper pattern being formed by a second semiconductor process; irradiating an electron beam onto the multi-layered structure to obtain an actual image of the upper and lower patterns; obtaining a first image representing the upper pattern and a second image representing the lower pattern from the actual image; matching each of the first and second images and a design image of the first and second patterns to determine an overlay between the upper pattern and the lower pattern; and compensating at least one of the first and second semiconductor processes based on the overlay measurement. |
地址 |
Suwon-si, Gyeonggi-do KR |