MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EQUIPPED WITH OVERLAPPING INSPECTION PROCESS, CAPABLE OF EFFECTIVELY CONFIRMING APPLIED PHOTOMASK

摘要

PURPOSE: A manufacturing method for a semiconductor device equipped with overlapping inspection process is provided to improve a manufacturing efficiency by performing alignment inspection of an applied photomask in an etching operation. CONSTITUTION: A semiconductor manufacturing method determines properness/improperness of a superposed position of a resist film formed on a superposed layer as a superpositive layer. Information of a superposition mark(611A) of the superposed layer provided on the superposed layer is read. Information of a resist film superposition mark(701A) provided on the resist film is read. Then, a mark position is determined by reading the positional relation between the superposition mark of the superposed layer and the superposition mark of the resist film and determining properness/improperness of the position of formation of the resist film with respect to the superposed layer. A mark alignment is determined by comparing the information of the superposition mark of the resist film with information of the superposition mark of a registered resist film previously registered and determining whether the resist film superposition mark is aligned with the registered resist film superposition mark.