| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a resist film by spin coating while suitably suppressing variations in the thickness of the film. <P>SOLUTION: In a precoat temperature adjustment section 10, a wafer is mounted on a hot plate 11 and is entirely heated on the hot plate 11, so that the temperature of the wafer is set at a predetermined temperature higher than the temperature of a clean room 1. In a spin coating section 20, a color resist solution is spin coated onto the wafer. In a prebaking section 30, the wafer coated with a color resist film in this way is treated at a temperature of 80°C or higher, thus tightly baking the color resist film. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
