| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a curable resin composition excellent in heat resistance and electrical characteristics. <P>SOLUTION: A cured product is obtained by curing the resin composition comprising a combination of a bifunctional phenylene ether oligomer and a cyanic ester resin, and has a high glass transition temperature, a low dielectric constant, and a low dielectric dissipation factor, and well-balanced properties inheriting excellent properties of the polyphenylene ether skeleton and the cyanic ester resin. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
