发明名称 Integrated device with inductive and capacitive portions and fabrication methods
摘要 Integrated devices and fabrication methods thereof are presented. The methods include, for instance fabricating an integrated device comprising an inductive portion and a capacitive portion, the integrated device being at least partially embedded within an electrode. The fabricating includes providing a conductive coil at least partially within an insulator layer above a substrate, the conductive coil comprising exposed portions, wherein the inductive portion of the integrated device comprises the conductive coil; covering exposed portions of the conductive coil with a dielectric material; and forming the electrode at least partially around the dielectric covered portions of the conductive coil, the electrode being physically separated from the conductive coil by the dielectric material, wherein the capacitive portion of the integrated device comprises the electrode, the dielectric material, and the conductive coil. In one embodiment, the method further includes: exposing at least one further portion of the conductive coil; and providing another electrode in electrical contact with the at least one exposed further portion of the conductive coil.
申请公布号 US9460996(B1) 申请公布日期 2016.10.04
申请号 US201514818351 申请日期 2015.08.05
申请人 GLOBALFOUNDRIES INC. 发明人 Zang Hui;Chi Min-hwa
分类号 H01L23/522;H01L23/528;H01L49/02 主分类号 H01L23/522
代理机构 Heslin Rothenberg Farley and Mesiti PC 代理人 Heslin Rothenberg Farley and Mesiti PC ;Mesiti Nicholas
主权项 1. A method comprising: fabricating an integrated device comprising an inductive portion and a capacitive portion, the fabricating comprising: providing a conductive coil at least partially within an insulator layer above a substrate, the conductive coil comprising exposed portions, wherein the inductive portion of the integrated device comprises the conductive coil;covering exposed portions of the conductive coil with a dielectric material;forming the electrode of the integrated device at least partially around the dielectric covered portions of the conductive coil, the electrode being physically separated from the conductive coil by the dielectric material, wherein the capacitive portion of the integrated device comprises the electrode, the dielectric material, and the conductive coil; andproducing another electrode in electrical contact with at least one further portion of the conductive coil.
地址 Grand Cayman KY