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发明名称
形成贯穿电极的方法及具有贯穿电极的基材
摘要
一种制造贯穿电极的方法,其中有一导电物会被嵌入一微孔内,该微孔有一端系仅由一导电材料形成的布线和接垫来封闭,而该布线和接垫不会破裂。在此制造贯穿电极的方法中,一导电物会被嵌入该微孔内,而该微孔会贯穿一基材并有一孔口被一导电薄膜所阻闭。在一护持该导电薄膜的保护物被制成于该基材设有导电薄膜的表面上之后,一导电物会被由该微孔的另一孔口来嵌入。
申请公布号
TW200416890
申请公布日期
2004.09.01
申请号
TW092135818
申请日期
2003.12.17
申请人
藤仓股份有限公司
发明人
山本敏;泷泽功
分类号
H01L21/3205
主分类号
H01L21/3205
代理机构
代理人
恽轶群;陈文郎
主权项
地址
日本
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